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Termomechanická spolehlivost pájeného připojení elektronických modulů s LTCC / Thermomechanical reliability of solder connection in electronic modules with LTCC

This thesis is considered about interconnect PCB with microelectronic and electronic modules and continuing on thesis MODERN CAUSES OF ASSEMBLY MICROELECTRONICS AND ELECTRONICS MODULES. This thesis includes, definition of termomechanical strain in solder joints and description of LTCC technology. Practical part includes characterization the causes of assembly with usage chip component and proposal footprint for PCBs, modules and results of temperature cycling of tested modules.

Identiferoai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:219357
Date January 2011
CreatorsKrajíček, Michal
ContributorsStarý, Jiří, Šandera, Josef
PublisherVysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Source SetsCzech ETDs
LanguageCzech
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/masterThesis
Rightsinfo:eu-repo/semantics/restrictedAccess

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