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Stress evaluation and reliability of electrically conductive adhesive interconnections

Zugl.: Freiburg (Breisgau), Univ., Diss., 2009

  1. http://d-nb.info/997085126/04
Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/560406787
Date January 2009
CreatorsLöw, Richard Constantin
PublisherTemplin Detert
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish

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