Advancements in the semiconductor industry have lead to the miniaturization of components and increased power densities, resulting in thermal management issues. Due to this shift, finding multifunctional materials with excellent thermal conductivity and electrical resistivity are becoming increasingly important. For this research thesis, thermally conductive polymer composites were developed and characterized. In the first study, a LLDPE matrix was combined with hBN and SiC to determine the effects of both filler type and filler content. Novel porous composite materials were also fabricated to align thermally conductive fillers, improving k_eff while significantly reducing the overall weight. In the second study, PPS was used as a high performance matrix material and combined with different types of hBN to investigate the effects of size, shape, and aspect ratio on the composite, as well as the effect of hybrid fillers. The composites were characterized with respect to their physical, thermal, electrical, and mechanical properties.
| Identifer | oai:union.ndltd.org:LACETR/oai:collectionscanada.gc.ca:OTU.1807/30534 |
| Date | 05 December 2011 |
| Creators | Chan, Ellen |
| Contributors | Naguib, Hani E., Dawson, Francis P. |
| Source Sets | Library and Archives Canada ETDs Repository / Centre d'archives des thèses électroniques de Bibliothèque et Archives Canada |
| Language | en_ca |
| Detected Language | English |
| Type | Thesis |
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