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Underfill adhesion characteristics, residual stresses and analysis of thermal stresses in flip chip packages /

Thesis (Ph. D.)--Hong Kong University of Science and Technology, 2003. / Includes bibliographical references. Also available in electronic version. Access restricted to campus users.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/52054143
Date January 2003
CreatorsSham, Man-Lung.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
SourceView Abstract or Full-Text.

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