Recently, there has been increasing demands for high dielectric materials to replace SiO2 for high-density dynamic random access memories with ultralarge scale integration. TiO2 and BaTiO3 are very promising insulators for applications to DRAMs, as they exhibit higher dielectric constant.The growths of TiO2 and BaTiO3 thin films on (100) silicon are studied by MOCVD using Ti(i-OC3H7)4, Ba(DPM)2(tetraene)2 and N2O as precursors. The growth was performed in a cold wall horizontal system in the temperature range of 350~700¢J. The growth rates of TiO2 and BaTiO3 films are affected by the Ti flow rate, growth temperature and reactor pressure. The structures of TiO2 and BaTiO3 films are polycrystalline by X-ray diffraction examinations. The dielectric constant of as-grown TiO2 can reach 85 and BaTiO3 can reach 300 derived by C-V curves with the contact area 3.14¡Ñ10-4 cm2. In addition, the influences of postannealing treatment under an O2 and N2 ambient with different annealing temperature and time on the structural and electrical properties of as-grown TiO2 films will be also studied.
However, TiO2 and BaTiO3 films have columnar structures acted the paths of leakage current. We use thermal annealing to reduce the leakage current. In the future, to enhance the dielectric constant and reduce the leakage current of the films is the goal in our study.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0703100-112500 |
| Date | 03 July 2000 |
| Creators | Fan, Ming-Chi |
| Contributors | Jeng Gong, Yeu-Hew Yang, Dong-Sing Wuu, Ming-Kwei Lee, Ray-Hua Horng |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | English |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0703100-112500 |
| Rights | unrestricted, Copyright information available at source archive |
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