This study aims to investigate the thermal fatigue life of the solder ball.Generally, the fatigue of the solder ball results from thermal cyclic loading in different thermal expansion coefficiency of the material in the IC package.
To analyze the equivalent stress and the equivalent strain distributions of the solder ball under loading, an analysis software ANSYS was adopted in this study. To stimulate viscoplastic (creep and plastic) property of the solder ball, the Anand model was adopted. From the modified Coffin-Manson equation and the viscoplastic strain range, the fatigue life of the solder ball was obtained finally.
The causes of the fatigue life of the solder ball in this study were attributed to many factors, such as the solider ball¡¦s geometry, substrate thickness, different material properties, change of pad diameter, etc. Finally, the researcher found the increasing solder joint reliability methods and supplied the improving solder joint data for the design engineer.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0621102-111104 |
| Date | 21 June 2002 |
| Creators | Ke, Chao-Fa |
| Contributors | Shyue-Jian Wu, Chorng-Fuh Liu, Shi-Pin Ho, none |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0621102-111104 |
| Rights | restricted, Copyright information available at source archive |
Page generated in 0.0018 seconds