This thesis addresses the problem of extracting heat from sealed electronic enclosures. Typical industry practice is to use various air-to-air and air-to-liquid heat exchangers. These techniques are known to require costly custom designs. This thesis points out how one can apply heat pipe technology in the form of a vapor chamber to solve this type of problem. The details on the design and testing of two prototype vapor chambers are cited. Included in the text are typical industrial applications that require sealed enclosures to protect their associated electronic control hardware. Also mentioned is some historical background on heat pipes.
| Identifer | oai:union.ndltd.org:ucf.edu/oai:stars.library.ucf.edu:rtd-1211 |
| Date | 01 January 1976 |
| Creators | Dougherty, Michael L. |
| Publisher | Florida Technological University |
| Source Sets | University of Central Florida |
| Language | English |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | Retrospective Theses and Dissertations |
| Rights | Written permission granted by copyright holder to the University of Central Florida Libraries to digitize and distribute for nonprofit, educational purposes. |
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