Thermoelectric devices are capable of providing both localized active cooling and waste heat power generation. This work will explore the possibility of embedding thermoelectric devices within electronic packaging in order to achieve better system performance. Intel and Nextreme, Inc. have produced thin-film superlattice thermoelectric devices that have above average performance for thermoelectrics and are much thinner than most devices on the market currently. This allows them to be packaged inside of the electronic package where the thermoelectric devices can take advantage of the increased temperatures and decreased thermal lag as compared to the devices being planted on the outside of the package. This work uses the numerical CFD solver FLUENT and the analog electronic circuit simulator SPICE to simulate activity of thermoelectric devices within an electronics package.
| Identifer | oai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/45867 |
| Date | 14 November 2012 |
| Creators | Sullivan, Owen A. |
| Publisher | Georgia Institute of Technology |
| Source Sets | Georgia Tech Electronic Thesis and Dissertation Archive |
| Detected Language | English |
| Type | Thesis |
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