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Deep chemical etching on quartz substrates and integrated passive devices

The purpose of the thesis is to investigate and the corrosion resistance of the masking materials on quartz substrates in deep chemical etching using NH4HF2 solutions. Masking materials, including Cr/Au, PLA-900 position photoresist, and NPR-2500F negative photoresist were used for test. In the deep etching of the quartz substrates, we observed changes of adhesion of the masking materials. The process parameters obtained from deep etching were used to fabricate quartz resonators. Before etch, the etch masks using Cr/Au thin films were deposited on both sides of the quartz substrates. Cr/Au masking materials were stripped after the etching, and Cr/Au electrodes were deposited by sputtering on both sides of quartz substrates. Finally, the quartz resonators were obtained by dicing. Passive devices, including capacitors and inductors were also fabricated and measured for integrated passive devices, such as band-pass filters.

Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0729110-135356
Date29 July 2010
CreatorsHuang, Chuan-Yi
ContributorsMei-Ying Chang, Ann-Kuo Chu, Yi-Jen Chiu, Wei-Yao Huang
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageCholon
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729110-135356
Rightsrestricted, Copyright information available at source archive

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