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Analysis of the Characteristics of Vias in Multilayer Printed Circuit Boards Using the Transmission Line Model

In high-speed digital circuits, in order to utilize the space of printed circuit boards efficiently, the signal via is a heavily used interconnection structure to communicate different signal layers. However, the interconnection discontinuities will result in the degradation of the signal integrity and become a crucial issue for IC designers. To analyze the problems accurately and fast using the hybrid physical equivalent model which combining the transmission line model, slot model, via model, and decoupling capacitor model, etc. Based on the method, we can get a good result of simulation and compute faster than Ansoft HFSS. In addition, by the hybrid physical model method, we simulate and discuss several interesting issues such as resonance in power/ground planes, and the effect of the simultaneous switching noise, we also improve the bad effect of the printed circuit boards existing vias by some ways.

Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0804108-181703
Date04 August 2008
CreatorsTien, Tsung-Yin
ContributorsTzyy-Sheng Horng, Chie-In Lee, Chih-Wen Kuo, Ken-Huang Lin
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageCholon
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0804108-181703
Rightsnot_available, Copyright information available at source archive

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