In this paper, a study of tungsten metallization in advanced BEOL interconnects is presented. A mature 10 nm process is used for comparison between the tungsten and conventional copper metallization. Wafers were processed together till M1 dual-damascene etch then separated for different metallization. Tungsten metal line of 24 nm width is showing a 1.6X wire resistance comparing to the copper metal line. Comparable opens/shorts yield were obtained on a 0.8 M comb serpentine, Kelvin-via and 4K via chains. Similar physical profile were also achieved. This study has demonstrated the feasibility of replacing the copper by tungsten at BEOL using the conventional tungsten metallization tools and processes. This could be a cost- effective solution for the low-power products.
| Identifer | oai:union.ndltd.org:DRESDEN/oai:qucosa.de:bsz:ch1-qucosa-207035 |
| Date | 22 July 2016 |
| Creators | Chen, James Hsueh-Chung, Fan, Susan Su-Chen, Standaert, Theodorus E., Spooner, Terry A., Paruchuri, Vamsi |
| Contributors | TU Chemnitz, Fakultät für Elektrotechnik und Informationstechnik |
| Publisher | Universitätsbibliothek Chemnitz |
| Source Sets | Hochschulschriftenserver (HSSS) der SLUB Dresden |
| Language | English |
| Detected Language | English |
| Type | doc-type:conferenceObject |
| Format | application/pdf, text/plain, application/zip |
| Source | AMC 2015 – Advanced Metallization Conference |
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