This paper demonstrates an approach for passive alignment and assembly of link components for board-level very-short range optical interconnects. This interchip optical link is based on planar polymeric multimode waveguides and glassbased electro-optical transceivers. The main aim of the work is the investigation of assembly processes of link components in order to fulfill the tolerance requirements using passive alignment. The optical characterization in regard to the optical coupling between link components will define the tolerances for the alignment process. This optical analysis is based on measurements of spatial coupling characteristics. The influence of assembly tolerances on the coupling efficiency is investigated. Flip-chip assembly of electro-optical devices on the glass interposer and of the glass interposer on optical overlay is presented to prove the implementation of the concept.
| Identifer | oai:union.ndltd.org:DRESDEN/oai:qucosa:de:qucosa:35102 |
| Date | 30 August 2019 |
| Creators | Nieweglowski, Krzysztof, Bock, Karlheinz |
| Publisher | SPIE |
| Source Sets | Hochschulschriftenserver (HSSS) der SLUB Dresden |
| Language | English |
| Detected Language | English |
| Type | info:eu-repo/semantics/publishedVersion, doc-type:conferenceObject, info:eu-repo/semantics/conferenceObject, doc-type:Text |
| Rights | info:eu-repo/semantics/openAccess |
| Relation | 10.1117/12.2227903 |
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