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Analysis of lead free tin-silver-copper and tin-lead solder wetting reactions

Thesis (Ph. D.)--State University of New York at Binghamton, Dept. of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/213433922
Date January 2007
CreatorsAnson, Scott J.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
TypeWeb sites. Electronic dissertations.
SourceOnline access via UMI:

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