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The most appropriate process scheduling for Semiconductor back-end Assemblies--Application for Tabu Search

Wire Bonder and Molding are the most costive equipments in the investment of IC packaging; and the packaging quality, cost and delivery are concerned most in the assembly processes. An inappropriate process scheduling may result in the wastes of resources and assembly bottleneck. Manager must allocate the resources appropriately to adapt the changeable products and production lines.
We would introduce several heuristic search methods, especially the Tabu search. Tabu search is one of the most popular methods of heuristic search. We also use Tabu list to record several latest moves and avoid to the duplication of the paths or loops. It starts from an initial solution and keep moving the solution to the best neighborhood without stock by Tabu. The iterations would be repeated until the terminating condition is reached.
At last of the report, an example will be designed to approach the best wire bonding and molding scheduling by Tabu search; and verify the output volume is more than those with FIFO in the same period of production time.
Tabu search will be then confirmed to be effective for flexible flow shop.

Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0725103-180501
Date25 July 2003
CreatorsTsai, Yu-min
ContributorsIran-yuan Lu, Tsuang Kuo, Hsien-tang Tsai
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageCholon
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0725103-180501
Rightsunrestricted, Copyright information available at source archive

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