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Temperature and bias ffect on wire-bond reliability for F1 & S2 type new wire evaluatione

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Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0624103-151847
Date24 June 2003
CreatorsHuang, Chen-may
ContributorsKer-Chang Hsieh, Bae-Heng Tseng, Der-shin Gan
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageCholon
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0624103-151847
Rightsrestricted, Copyright information available at source archive

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