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The Study of Microstructure Analysis of Sn-Zn And Sn-Zn-Al Solder Ball in BGA Package.

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Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0702104-150209
Date02 July 2004
CreatorsWang, Shuo-hung
ContributorsDer-shin Gan, Ker-chang Hsieh, Bing-hwait Hwang
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageCholon
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0702104-150209
Rightsnot_available, Copyright information available at source archive

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