Due to the introduction of Restriction of Hazardous Substances (RoHS) directive Pb containing solders have been banned from the electronics industry and a reliable replacement for the Sn-Pb solder is being sought for by industry around the globe. Medical and Defense industries are currently exempt from the directive and use Sn-Pb solder in their manufacturing process. The switch to lead-free has led component manufacturers to use different lead-free solders, thus causing mixed solder joints of lead-free components with Sn-Pb paste. In this study, mixed assembly microstructures and mechanical properties were examined. Furthermore, six novel lead-free solders were prepared using SAC105 solder doped with elements: Ti, Ni, Mn, La, Ce and Y. The solidification microstructures, fracture behavior and wetting properties of these solders were evaluated to find a suitable replacement for SAC105 solder.
| Identifer | oai:union.ndltd.org:TORONTO/oai:tspace.library.utoronto.ca:1807/30652 |
| Date | 08 December 2011 |
| Creators | Kaila, Rishi |
| Contributors | Perovic, Doug |
| Source Sets | University of Toronto |
| Language | en_ca |
| Detected Language | English |
| Type | Thesis |
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