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Failure mechanism of lead-free Sn-Ag-Cu solder BGA interconnects

Thesis (M.S.)--State University of New York at Binghamton, Department of Mechanical Engineering, 2005. / Includes bibliographical references (leaves 70-72).

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/184842008
Date January 2005
CreatorsDhakal, Ramji.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
TypeWeb sites. Electronic dissertations.
SourceOnline access via UMI:

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