The Study of Microstructure Analysis of Pb/Sn And Sn/Ag/Cu Solder Ball in BGA Package.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-1204101-061207 |
| Date | 04 December 2001 |
| Creators | CHI, Chin-Shu |
| Contributors | Ker-Chang Hsieh, Der-Shin Gan, Bae-Heng Tseng |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1204101-061207 |
| Rights | not_available, Copyright information available at source archive |
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