This thesis deals with possibilities of increasing the yield of BGA repair process. First there is mentioned basic problematics and its notions, problems and possibilities. Next it deals with technological aspects of repairing of devices in BGA covers. Also there is mentioned basic problematics of evaluating of yield. There is stated current state of solving the problem and also there is suggested new design of application which would be more optimal for evaluation of the yield of process. This thesis contains results of practical testing of methods of application of flux affecting final quality of solder joints as well as kind of flux which was used. At the end
| Identifer | oai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:221113 |
| Date | January 2015 |
| Creators | Janíček, Martin |
| Contributors | Vala, Radek, Řihák, Pavel |
| Publisher | Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií |
| Source Sets | Czech ETDs |
| Language | Czech |
| Detected Language | English |
| Type | info:eu-repo/semantics/masterThesis |
| Rights | info:eu-repo/semantics/restrictedAccess |
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