Project is focused on describe modern assembly of microelectronic and electronic modules in electronic devices. Sense of the project is analyse reliability and inadequacies electronic devices assembled by modern technogies. Inadequacies modern technologies are impulse for design, implementation and testing new our way of assembly microelectronic modules. Main kind of materials which are used in this project are ceramics Al2O3 and printed circuit board FR4.
| Identifer | oai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:218694 |
| Date | January 2010 |
| Creators | Janík, Pavel |
| Contributors | Švecová, Olga, Šandera, Josef |
| Publisher | Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií |
| Source Sets | Czech ETDs |
| Language | Czech |
| Detected Language | English |
| Type | info:eu-repo/semantics/masterThesis |
| Rights | info:eu-repo/semantics/restrictedAccess |
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