Return to search

Termomechanická spolehlivost montáže mikroelektronických a elektronických modulů / Modern Assembly for Microelectronic and Electronic Modules

Project is focused on describe modern assembly of microelectronic and electronic modules in electronic devices. Sense of the project is analyse reliability and inadequacies electronic devices assembled by modern technogies. Inadequacies modern technologies are impulse for design, implementation and testing new our way of assembly microelectronic modules. Main kind of materials which are used in this project are ceramics Al2O3 and printed circuit board FR4.

Identiferoai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:218694
Date January 2010
CreatorsJaník, Pavel
ContributorsŠvecová, Olga, Šandera, Josef
PublisherVysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Source SetsCzech ETDs
LanguageCzech
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/masterThesis
Rightsinfo:eu-repo/semantics/restrictedAccess

Page generated in 0.0018 seconds