Return to search

Mikroskopická analýza bezpečnosti čipů / Microscopic Analysis of Chips Security

The goal of this thesis is to work out an introduction to the chip packaging and decapsulation. Further can be found a description of a method leading to dacapsulate concrete chips. Final part is devoted to getting chip pictures using microscope and analysis of the pictures afterwards.

Identiferoai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:237016
Date January 2011
CreatorsMalčík, Dominik
ContributorsHanáček, Petr, Drahanský, Martin
PublisherVysoké učení technické v Brně. Fakulta informačních technologií
Source SetsCzech ETDs
LanguageCzech
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/masterThesis
Rightsinfo:eu-repo/semantics/restrictedAccess

Page generated in 0.0018 seconds