The Effect of Chloride Ion and Copper Oxide Layer on Plastic-encapsulated Package Reliability

Description

None

Links & Downloads

1. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0620101-190653

Tags

lead frame

golden

chloride

wire bonding

aluminum

package

copper oxide

Additional Fields

Identifer	oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0620101-190653
Date	20 June 2001
Creators	Huang, Sheng-Tzung
Contributors	K. Y. Hsieh, Bae-Heng Tseng, Tsu-Hsin Chang, Ker-Chang Hsieh
Publisher	NSYSU
Source Sets	NSYSU Electronic Thesis and Dissertation Archive
Language	Cholon
Detected Language	English
Type	text
Format	application/pdf
Source	http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0620101-190653
Rights	not_available, Copyright information available at source archive