The effect of joint strength of PbSn and AuSn solder in aging test for
laser module packaging has been studied experimentally. The thermal
conditions were aged at 150 ¢J for 1,4,9,16,25 and 36 days. It was
found that the joint strength decreased as aging test time increased. The
joint strength of PbSn solder with the gold coating on SUS304 substrate
of 2 µm and 10 µm decreased about 17% and 28% after aging test,
respectively. The joint strength of PbSn solder with the gold coating on
SUS304 substrate of 2 µm and 10 µm decreased about 16% and 9% after
aging test, respectively.
we also presented the microstructure of the intermetallic compound
¡]IMC ¡^growth under aging test. Results showed that the thickness of
the IMC increased after aging test. The growth thickness of the IMC
from 1 to 36 days for the PbSn and AuSn solder were measured to be
5.26 to 34.37 and 0.48 to 1.64 µm, respectively. The joint strength
decreased under aging test may be due to the crack and void defects
increased within the solder. The crack and void defects in solder were
observed by metallographic photos.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0627101-190707 |
| Date | 27 June 2001 |
| Creators | Denq, Horng-Jenq |
| Contributors | Szu-Chun Wang, Wood-Hi Cheng, Maw-Tyan Sheen, Jao-Hwa Kuang, Ching-Ting Lee |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0627101-190707 |
| Rights | not_available, Copyright information available at source archive |
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