Return to search

Low Percolation Threshold in Electrically Conductive Adhesives using Complex Dimensional Fillers

No description available.
Identiferoai:union.ndltd.org:OhioLink/oai:etd.ohiolink.edu:akron1542727822099192
Date January 2018
CreatorsTaubert, Clinton J.
PublisherUniversity of Akron / OhioLINK
Source SetsOhiolink ETDs
LanguageEnglish
Detected LanguageEnglish
Typetext
Sourcehttp://rave.ohiolink.edu/etdc/view?acc_num=akron1542727822099192
Rightsunrestricted, This thesis or dissertation is protected by copyright: all rights reserved. It may not be copied or redistributed beyond the terms of applicable copyright laws.

Page generated in 0.0018 seconds