International Telemetering Conference Proceedings / October 25-28, 1999 / Riviera Hotel and Convention Center, Las Vegas, Nevada / The Microelectronics and Computer Technology Corporation (MCC) has developed a rapid turn around process for fabricating multichip modules (MCM’s) called the Flexible Manufacturing of MCM’s (FMM). The Army Research Lab (ARL) in co-operation with the Applied Physics Laboratory (APL), has investigated the survivability of this technology in high-g applications. Comparisons were made to other packaging technologies by constructing a 3-channel digital recorder in this and two other competing technologies.
| Identifer | oai:union.ndltd.org:arizona.edu/oai:arizona.openrepository.com:10150/608736 |
| Date | 10 1900 |
| Creators | Muller, Peter, Burke, Larry, Sommerfeldt, Scott, Lunceford, Brent, Francomacaro, Shaun, Lehtonen, S. John |
| Contributors | Army Research Laboratory, Microelectronics and Computer Technology Corporation, Johns Hopkins University |
| Publisher | International Foundation for Telemetering |
| Source Sets | University of Arizona |
| Language | en_US |
| Detected Language | English |
| Type | text, Proceedings |
| Rights | Copyright © International Foundation for Telemetering |
| Relation | http://www.telemetry.org/ |
Page generated in 0.0019 seconds