In this work, the use of a lunar regolith simulant as feedstock for the direct ink writing additive manufacturing process is explored, the purpose of which is to enable future lunar in-situ resource utilisation. The feasibility of this approach is demonstrated in a laboratory setting by manufacturing objects with different geometries using methyl cellulose or sodium alginate as binding agents and water as liquid phase together with the lunar regolith simulant EAC-1A to create a viscous, printable ‘ink’ that is used in combination with a custom three-axis gantry system to produce green bodies for subsequent sintering. The sintered objects are characterised using compressive strength measurements and scanning electron microscopy (SEM). It is proposed that the bioorganic compounds used in this work as additives could be produced at the site for a future lunar base through photosynthesis, utilising carbon dioxide exhaled by astronauts together with the available sunlight, meaning that all the components used for the dispersion – additive, water (in the form of ice) and regolith – are available in-situ. The compressive strength for sintered samples produced with this method was measured to be 2.4 MPa with a standard deviation of 0.2 MPa (n = 4). It is believed, based on the high sample porosity observed during SEM analysis, that the comparatively low mechanical strength of the manufactured samples is due to a non-optimal sintering procedure carried out at a too-low temperature, and that the mechanical strength could be increased by optimising the sintering process further.
| Identifer | oai:union.ndltd.org:UPSALLA1/oai:DiVA.org:uu-418249 |
| Date | January 2020 |
| Creators | Grundström, Billy |
| Publisher | Uppsala universitet, Tillämpad materialvetenskap |
| Source Sets | DiVA Archive at Upsalla University |
| Language | English |
| Detected Language | English |
| Type | Student thesis, info:eu-repo/semantics/bachelorThesis, text |
| Format | application/pdf |
| Rights | info:eu-repo/semantics/openAccess |
| Relation | UPTEC K, 1650-8297 ; 20026 |
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