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Computer simulation of IC packaging effects by FDTD method.

by Ng Chi-Keung. / Thesis (M.Phil.)--Chinese University of Hong Kong, 1998. / Includes bibliographical references (leaves 127-134). / Abstract also in Chinese. / Abstract --- p.2 / 摘要 --- p.3 / Acknowledgements --- p.4 / Chapter Chapter 1 --- Introduction --- p.7 / Chapter Chapter 2 --- Packaging Effects of Integrated Circuits --- p.9 / Chapter 2.1 --- The Structure of the IC Package --- p.9 / Chapter 2.2 --- Microstrip Discontinuities --- p.11 / Chapter Chapter 3 --- The Finite-Difference Time-Domain Method --- p.19 / Chapter 3.1 --- Basic Theory --- p.19 / Chapter 3.2 --- Stability Criterion --- p.25 / Chapter 3.3 --- Formulation of Source --- p.30 / Chapter A. --- Source Function --- p.30 / Chapter (i) --- Sinusoidal --- p.30 / Chapter (ii) --- Gaussian Pulse --- p.31 / Chapter B. --- Source Realization --- p.36 / Chapter (i) --- Electric Field Source --- p.36 / Chapter (ii) --- Lumped Source --- p.38 / Chapter (iii) --- Current Source --- p.40 / Chapter C. --- Source Placement --- p.41 / Chapter 3.4 --- Parameter Extraction --- p.42 / Chapter A. --- Voltage and Current --- p.42 / Chapter B. --- Characteristic Impedance --- p.44 / Chapter C. --- Effective Dielectric Constant --- p.45 / Chapter D. --- Scattering Parameters --- p.46 / Chapter 3.5 --- Termination and Boundary Treatment --- p.48 / Chapter A. --- Perfect Electric Conductor (PEC) --- p.48 / Chapter B. --- Perfect Magnetic Conductor (PMC) --- p.49 / Chapter C. --- Interface between Two Materials --- p.50 / Chapter 3.6 --- Perfectly Matched Layer (PML) --- p.54 / Chapter A. --- Theory of PML in Three Dimensions --- p.56 / Chapter B. --- Incorporation of PML as Absorbing Boundary Condition (ABC) --- p.65 / Chapter C. --- Discretization of Maxwell's Equations in PML --- p.73 / Chapter 3.7 --- Flowcharts --- p.75 / Chapter A. --- Free Space Radiation by a Dipole Antenna --- p.77 / Chapter B. --- Parameters of a Microstrip Line --- p.79 / Chapter C. --- Scattering Parameters of Planar Network --- p.85 / Chapter 3.8 --- Summary --- p.87 / Chapter Chapter 4 --- Effects of Ground Via Allocation --- p.88 / Chapter 4.1 --- Introduction --- p.88 / Chapter 4.2 --- Simulation and Experimental Results --- p.91 / Chapter 4.3 --- Equivalent Circuit Modelling --- p.108 / Chapter 4.4 --- Summary --- p.124 / Chapter Chapter 5 --- Conclusions --- p.125 / Chapter Chapter 6 --- Recommendation for Future Work --- p.126 / References --- p.127 / Publication --- p.134

Identiferoai:union.ndltd.org:cuhk.edu.hk/oai:cuhk-dr:cuhk_322216
Date January 1998
ContributorsNg, Chi-Keung., Chinese University of Hong Kong Graduate School. Division of Electronic Engineering.
Source SetsThe Chinese University of Hong Kong
LanguageEnglish, Chinese
Detected LanguageEnglish
TypeText, bibliography
Formatprint, 134 leaves : ill. (some col.) ; 30 cm.
RightsUse of this resource is governed by the terms and conditions of the Creative Commons “Attribution-NonCommercial-NoDerivatives 4.0 International” License (http://creativecommons.org/licenses/by-nc-nd/4.0/)

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