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3-dimensional chip integration technology and critical issues

Zugl.: Ulm, Univ., Diss., 2009

  1. http://d-nb.info/998933112/04
Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/608726251
Date January 2009
CreatorsBenkart, Peter
PublisherNorderstedt BoD, Books on Demand
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish

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