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Schnelle 3D-Objektvermessung mittels PMD-, CMOS-Kombizeilensensor und Signalkompressions-Hardware

Siegen, Universiẗat, Diss., 2000.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/76220344
Date January 2000
CreatorsHussmann, Stephan.
Publisher[S.l. : s.n.],
Source SetsOCLC
LanguageGerman
Detected LanguageGerman

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