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Study of Integration Technology for Stacking Package

The thesis is mainly focused on the investigation of optimal process operation, which is appropriate for new-type stacking package product to achieve the assembly products of two or more packages. By melting solder balls to form the stacking package products, the eventual goals of lightness, thinness and smallness will be accomplished. To increase and stabilize the production yield of stacking package products, different flux, different temperature setting with reflow oven, and different flux dipping method were used. With Taguchi design of experiment, the solder balls combined situations under varied conditions were observed. The best process character of new-type integration assembly products was achieved.
The experimental results and mass production data prove that different flux type and temperature setting with reflow oven won¡¦t influence the solder balls connection between two package products. Only the flux dipping method will directly affect solder balls connection between two package products. The abnormal phenomenon is the so-called cold joint in assembly plants.
With innovation, silicon gel head is used as a flux adhesive way to achieve the goal of flux transferred. This method can be used in integration process of new-type stacking package products. That will certainly assure that every solder ball on each package product can be helpful for adhesion of flux. The experiments proved that the yield rate of solder balls connection of two package products is 100% after the stacking package products through reflow oven. This proves that using flux with silicon gel head on new-type stacking package products is the best way of process operation. The innovation of this new process has been granted a patent by the Patent office, ROC. Although this is a simple invention, it will bring profit to ASE Co. as well and ensure the leadership of new-type stacking package products in related industries.
Keywords: Stack¡BSolder Ball¡BCold Joint¡BSilicon Pad

Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0204107-123616
Date04 February 2007
CreatorsCheng, Ming-Hsiang
ContributorsMing-Hwa Jen, Ming Chen, Jun Chen
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageCholon
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0204107-123616
Rightsrestricted, Copyright information available at source archive

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