Return to search

Technologie přípravy hlubokých struktur v submikronovém rozlišení / Submicron Structures with Deep Relief — Technology of Preparation

The dissertation thesis is focused on research and development in the field of microfabrication by the technology of electron beam lithography. In the first part of this work, the extensive study is conducted in the field of technology of electron beam lithography in terms of physical principles, writing strategies and resist materials. This is followed with description of physical principles of etching for the transfer of relief structures into substrates. The thesis describes innovative techniques in modelling, simulation, data preparation and optimization of manufacturing technology. It brings new possibilities to record deep binary or multilevel microstructures using electron beam lithography, plasma and reactive ion etching technology. Experience and knowledge in the large area of microlithography, plasma and anisotropic wet-etching of silicon have been capitalized to the design process of manufacturing of nano-patterned membranes. It was followed with practical verification and optimization of the microfabrication process.

Identiferoai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:256584
Date January 2017
CreatorsMatějka, Milan
ContributorsKuřitka,, Ivo, Mgr. Petr Klapetek Ph.D, Kolařík, Vladimír
PublisherVysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Source SetsCzech ETDs
LanguageCzech
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/doctoralThesis
Rightsinfo:eu-repo/semantics/restrictedAccess

Page generated in 0.0017 seconds