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Study of thermally reworkable epoxy materials and thermal conductivity enhancement using carbon fiber for electronics packaging

No description available.
Identiferoai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/5342
Date01 December 2003
CreatorsLi, Haiying
PublisherGeorgia Institute of Technology
Source SetsGeorgia Tech Electronic Thesis and Dissertation Archive
Languageen_US
Detected LanguageEnglish
TypeDissertation
Format5239186 bytes, application/pdf

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