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An experimental study of endwall heat transfer enhancement for flow past staggered non-conducting pin fin arrays

In this work, we study the enhanced endwall heat
transfer for flow past non conducting pin fin arrays. The aim is to resolve the controversy over the heat transfer that is taking place from the endwall and the pin surface.Various parameters were studied and results were obtained. Our results are found to be consistent with some of the results that have been previously
published. The results were surprisingly found to be dependent on
the height of the pin fin.

Identiferoai:union.ndltd.org:tamu.edu/oai:repository.tamu.edu:1969.1/140
Date30 September 2004
CreatorsAchanta, Vamsee Satish
ContributorsLau, Sai C.
PublisherTexas A&M University
Source SetsTexas A and M University
Languageen_US
Detected LanguageEnglish
TypeBook, Thesis, Electronic Thesis, text
Format704731 bytes, 42804 bytes, electronic, application/pdf, text/plain, born digital

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