Abstract
The objectives of this thesis are to investigate the microstructures and the corrosion resistance of chromium (Cr) and nichrome (Ni-Cr) thin films deposited by rf magnetron sputtering. Different rf powers were used to prepare the Cr thin films on glass substrates. The thin films were then patterned and subsequently annealed in vacuum environment. The targets used for the sputtering are commercially available Cr and nichrome with 4N and 99.95% purity, respectively. Two different nichrome targets were used. The composition of Ni in nichrome are 40 and 80%. The sputtered samples were etched by reactive ion etching in a mixture of SF6 and O2 for testing the corrosion resistance of the deposited films. The thin films with excellent surface morphology and corrosion resistance can be obtained by preparing the films at a low rf power. This is because the films had lower stress and less defects than the films prepared by high rf powers.
At a low power of 20W, the etching rates as low as 120Å/min and 50 Å/min for Cr and nichrome were achieved. The annealing effect of the deposited films at different temperature are also discussed.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0619100-150526 |
| Date | 19 June 2000 |
| Creators | Wu, Hong-Zhan |
| Contributors | A. K. Chu, Chien-Hsiang Chao, Kuang-Yen Hsieh |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0619100-150526 |
| Rights | restricted, Copyright information available at source archive |
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