Reliability of lead-free and advanced interconnects in fine pitch and high I/O electronics subjected to harsh thermo-mechanical environments

Description

Thesis--Auburn University, 2009. / Abstract. Includes bibliographical references (p. 170-177).

Links & Downloads

1. http://hdl.handle.net/10415/1907

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Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/451801725
Date	January 2009
Creators	Hinshaw, Robert Bruce. Lall, Pradeep,
Publisher	Auburn, Ala.,
Source Sets	OCLC
Language	English
Detected Language	English