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A Study on Residual stresses and Creep Deformation in Laser Module Packaging

The roles of residual stresses distribution and creep deformation in the post-weld-shifts (PWS) of a laser model packaging are investigated in this dissertation. The temperature dependent material properties are employed to calculate the distribution of the residual stresses introduced in the solidification of soldering joints and lasering joints respectively. A power law proposed by Norton is applied to the creep deformation calculation. The post-weld-shifts of fiber-solder-ferrule (FSF) introduced in the aging and temperature cycling tests are simulation. A finite element package ¡V MARC is used to module the fiber-solder-ferrule joint and laser joint respectively. Experimental results of the PWS of a FSF joint are compared with the calculated shifts. Results indicate that the redistribution of residual stresses in joint and the creep deformation under high temperature load may affect the PWS significantly. A good agreement between the simulated and the measured results indicate the proposed model is feasible in the laser module packaging analysis.

Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0721100-110049
Date21 July 2000
CreatorsSheen, Maw-Tyan
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageCholon
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0721100-110049
Rightsunrestricted, Copyright information available at source archive

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