Models for thermo-mechanical eliability trade-offs for ball grid array and flip chip packages in extreme environments

Description

Thesis(M.S.)--Auburn University, 2007. / Abstract. Vita. Includes bibliographic references.

Links & Downloads

1. http://repo.lib.auburn.edu/2006%20Fall/Theses/HARIHARAN_GANESH_55.pdf

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Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/228446274
Date	January 2007
Creators	Hariharan, Ganesh, Lall, Pradeep.
Publisher	Auburn, Ala. ,
Source Sets	OCLC
Language	English
Detected Language	English