Thermo-mechanical reliability of flip-chip assemblies with heat spreaders

Description

Techn. University, Diss., 2003--Berlin.

Links & Downloads

1. http://edocs.tu-berlin.de/diss/2003/wunderle_bernhard.pdf
2. http://edocs.tu-berlin.de/diss/2003/wunderle_bernhard.htm
3. http://deposit.d-nb.de/cgi-bin/dokserv?idn=968327206

Tags

Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/175160919
Creators	Wunderle, Bernhard.
Source Sets	OCLC
Language	English
Detected Language	English