Assembly process development, reliability and numerical assessment of copper column flexible flip chip technology

Description

Thesis (Ph. D.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, Thomas J. Watson School of Engineering and Applied Science, 2008. / Includes bibliographical references.

Links & Downloads

1. http://proxy.binghamton.edu/login?url= http://wwwlib.umi.com/dissertations/fullcit/3324387

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Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/425765539
Date	January 2008
Creators	Lin, Ta-Hsuan.
Source Sets	OCLC
Language	English
Detected Language	English
Type	Electronic books. Electronic dissertations.
Source	Online access via UMI: