Quality is an important measurement within a semiconductor manufactory. Due to the fact that yield is directly affected by quality of the manufacturing process, in this paper a quality based scheduling approach will be presented which compares different methods like dispatching, MIP and CP, regarding different objectives. To test the different used methods a benchmark model of a semiconductor manufactory is build up. Here a lithography work center is used in detail where the rest of the fabrication is only build up as a delay station. With this model the repeatability for the example of a lithography step is investigated. Thereby in this investigation it is assumed, that each lithography tool has an offset which is transferred to the structure. Now the quality of a product should be best, if the offset from one layer to the next layer is minimized.
Identifer | oai:union.ndltd.org:DRESDEN/oai:qucosa:de:qucosa:74729 |
Date | 30 April 2021 |
Creators | Doleschal, Dirk, Schöttler, Elisa Sophie |
Publisher | IEEE |
Source Sets | Hochschulschriftenserver (HSSS) der SLUB Dresden |
Language | English |
Detected Language | English |
Type | info:eu-repo/semantics/updatedVersion, doc-type:conferenceObject, info:eu-repo/semantics/conferenceObject, doc-type:Collection |
Rights | info:eu-repo/semantics/openAccess |
Relation | 10.1109/WSC.2017.8248086, info:eu-repo/grantAgreement/European Commission/H2020 | ECSEL-IA/737459//Productive4.0/Electronics and ICT as enabler for digital industry and optimized supply chain management covering the entire product lifecycle |
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