The continuing of industrial revaluation and capitalism today are facing the most difficult enemy ever. 38 billion years of natural resources will be destroyed and over utilized within the next 10 years. The global business will be paying 1500 billion dollars to overcome the effect of changing wheather and natural environment especially those digital industry. The global high tech industry is having a ¡§Green colour¡¨ hits. It is not a war in invoice competition. It is a war for life. The continues of the technological advantages and fast development in industry, have bringing in a convenient life to human being but on the other hand it had introduced lots of troubles in our natural environment. The awareness of our natural environment began in 1970, the first ¡§Global Day¡¨ continues in 1972, Stockholm¡¦s environment and development conference, people begins their awareness of our natural environment, knowledge, understanding and its trouble.
In August this year the European alliances will be announcing the three directions of the law in the waste of electrical engineering and facility and electrical facility and products awareness. Therefore the producers have to register their product before August this year. Which includes the digital produce company, products, after sales services and recycling business are all effected bye the law. The following trend of Green Process will be the next demand on industry generation. Under the green process direction, every products that produced have to be recyclable, Lead free,
Halogen free . Therefore the trend will bring to a whole new revolution of digital industry.
Taiwan¡¦s IC packing industry is one of the most important rule to be a part in global semiconductor. In order to be part of trend, and facing the changing environment, follow the flow is the only way to continue the business. Our aim for this research is to discover the green products¡¦ that¡¦s affect to the packing industry.
Our research is hoping to discover a deep underneath for every cases of green process products changing and to the IC packing industry. We also hoping the research could analyze the future development of the green process environment.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0205106-231224 |
| Date | 05 February 2006 |
| Creators | Su, Chen-ping |
| Contributors | Chi-cheng Wu, Chin-Tarn Lee, Ming-rea Kao |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0205106-231224 |
| Rights | not_available, Copyright information available at source archive |
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