The use of the microstrip antenna has grown rapidly for the last two decades, because of the increasing demand for a low profile antenna with small size, low cost, and high performance over a large spectrum of frequencies. However, despite the advantages microstrip antennas provide, a number of technical challenges remain to be solved for microstrip antennas to reach their full potential, particularly if they are to be interfaced with monolithic circuits. The objective of this thesis is to examine novel methods for integrating and constructing broadband microstrip antennas, particularly at high microwave and millimeter wave frequencies where dimensions get very small and fabrication tolerances are critical. The first stage of the thesis investigates techniques to reduce the spurious feed radiation and surface wave generation from edge-fed patch antennas. A technique to reduce the spurious radiation from the edge-fed patch antenna by using a dielectric filled cavity behind the radiating element is explored. From this, a single element edge-fed cavity backed patch antenna was developed. Measured results showed low levels of cross polarization, making it suitable for dual or circular polarization applications. A 2 x 2 edge-fed cavity backed patch antenna array was also developed, which benefited greatly from this new technique due to the extensive feed network required. Furthermore, investigation into edge-fed cavity backed patches on high dielectric materials was also conducted. The measured impedance bandwidth of this edge-fed cavity backed patch is three times greater than the conventional edge-fed patch, and the gain increases to 5.1 dBi compared to 3.6 dBi. Further bandwidth enhancement of the single element edge-fed cavity backed antenna on high dielectric material was achieved by applying the hi-lo substrate structure. The hi-lo substrate structure produced an increase in the bandwidth to 26% from the 1.7% of the single element edge-fed cavity backed patch, while maintaining pattern integrity and radiation efficiency. Next, the development of a flip-chip bonding technique was investigated to enhance the fabrication accuracy and robustness of multilayer antennas on high dielectric materials. This technique was proven through simulation and experiment to provide good impedance and radiation performance via the high accuracy placement of the superstrate layer. The single element flip-chip patch antenna uses a high dielectric constant material for both the base and the patch superstrate, whereas the stacked flip-chip patch again uses a high and low permittivity material combination to achieve efficient wideband performance. Due to the high permittivity feed material, these antennas display the attributes required for integration with MMICs. The measured 10 dB return loss bandwidth of the single element was 4% with a gain of 4.6 dBi, whereas the stacked flip-chip patch showed very broadband performance, with a bandwidth of 23% with a gain of 8.5 dBi. The high accuracy placement and rigid attachment of the upper superstrat e layer via the flip-chip bonding technique also enables these antennas to be scaled up to millimeter-wave operational frequencies. The final section of this thesis is focused on developing a fabrication technique to enable the creation of a low permittivity layer at a nominated thickness.
| Identifer | oai:union.ndltd.org:ADTP/211305 |
| Date | January 2009 |
| Creators | Elmezughi, Abdurrezagh, s3089087@student.rmit.edu.au |
| Publisher | RMIT University. Electrical and Computer Engineering |
| Source Sets | Australiasian Digital Theses Program |
| Language | English |
| Detected Language | English |
| Rights | http://www.rmit.edu.au/help/disclaimer, Copyright Abdurrezagh Elmezughi |
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