An interactive software shell has been developed which integrates several packaging simulation tools developed at the University of Arizona which are used to analyze electro-magnetic coupling between interconnects in an integrated circuit. This software shell uses experimental frames to manage this simulation process. Through the experimental frames, the model descriptions and the model inputs are separated, and input data is verified for correctness. This model/input separation allows several model variations to be tested based on several input variations. The results of these simulations are then analyzed and displayed graphically. Further work for the software shell is discussed. This tool provides a user-friendly, efficient method for performing coupled-line analyses in interconnect systems.
| Identifer | oai:union.ndltd.org:arizona.edu/oai:arizona.openrepository.com:10150/277105 |
| Date | January 1989 |
| Creators | Whipple, Thomas Driggs, 1961- |
| Contributors | Rozenblit, Jerzy W. |
| Publisher | The University of Arizona. |
| Source Sets | University of Arizona |
| Language | en_US |
| Detected Language | English |
| Type | text, Thesis-Reproduction (electronic) |
| Rights | Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author. |
Page generated in 0.0056 seconds