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Ultra thin ultrafine-pitch chip-package interconnections for embedded chip last approach

Thesis (M. S.)--Materials Science and Engineering, Georgia Institute of Technology, 2008. / Committee Chair: Prof. Rao R Tummala; Committee Member: Dr. Jack Moon; Committee Member: Dr. P M Raj.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/268988351
Date January 2008
CreatorsMehrotra, Gaurav.
PublisherAtlanta, Ga. : Georgia Institute of Technology,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
SourceAvailable online, Georgia Institute of Technology:

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