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Scaling and process effect on electromigration reliability for Cu/low k interconnects

Thesis (Ph. D.)--University of Texas at Austin, 2007. / Vita. Includes bibliographical references.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/173517732
Date January 1900
CreatorsPyun, Jung Woo,
Publisher[Austin, Tex. : University of Texas Libraries,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish

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