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Advances in electronic packaging technologies by ultra-small microvias, super-fine interconnections and low loss polymer dielectrics

Thesis (M. S.)--Materials Science and Engineering, Georgia Institute of Technology, 2009. / Committee Chair: Tummala, Rao; Committee Member: Iyer, Mahadevan; Committee Member: Saxena, Ashok; Committee Member: Swaminathan, Madhavan; Committee Member: Wong, Chingping.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/456232158
Date January 2009
CreatorsSundaram, Venkatesh.
PublisherAtlanta, Ga. : Georgia Institute of Technology,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
SourceAvailable online, Georgia Institute of Technology:

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