Reliability of integrated circuit (IC) packages is in great demand for the automotive industry, as they are used in almost every electronic components. IC packages consist of essentially molding compound (MC), lead frame (LF), adhesive and a silicon chip. The elastic mismatch between the components makes the interfaces susceptible to crack initiation, propagation and eventual failure. The main reason of the failure is the thermo-mechanical cycles during the service time. This work presents the robustness estimation and the reliability based robustness improvement of an IC package by minimization of both crack driving force and its standard deviation at the MC and the LF interface with respect to the fatigue fracture toughness.
The robustness evaluation and robust design optimization were performed by taking the uncertainty in geometrical parameters into account. Evidently, there are more robust and reliable designs than the current design which have less crack driving force and show less variation. In order to quantify the reliability with respect to the variation of the crack driving force, the fatigue fracture toughness of the interface was characterized under isothermal conditions at 25 ◦C and −40 ◦C with a three point bending test apparatus. The interface characterizations at low temperatures like −40 ◦C is a main concern due to large stress generation during the reliability tests.
After then, a test methodology was prepared to validate the fatigue fracture toughness of the interface in the package level. Artificial cracks were introduced at the MC-LF interface in IC packages to predict the crack growth under thermal cycling over a temperature range of −50 ◦C to 150 ◦C. A prediction quality assisted to validate, whether the fatigue fracture toughness, which was obtained mechanically under isothermal conditions, could be used to predict the crack growth in the IC package under thermo-mechanical cycles.
Material characterization of the MC and the LF was performed to acquire the fatigue fracture toughness and the crack length by the compliance calibration method as accurate as possible. The mechanical modeling of both materials was accomplished with elasticity plus plasticity at the room temperature. Then the material models were verified by using the behavior of the bi-material structure under three point bending.
As the numerical simulations were used to calculate the fracture toughness, this thesis also presents a comparison between the methods in the literature by using finite element simulations. The results were compared with the analytic solution according to their accuracy, ease of implementation and mesh independence. Simultaneously, various crack tip elements were analyzed in contrast considering their capability of fracture toughness calculation. The analyses were included different fracture mechanical concepts from linear elastic to elastic plastic fracture mechanics. The comparison led to a more convenient method and crack tip element preference for the interface characterization.
| Identifer | oai:union.ndltd.org:DRESDEN/oai:qucosa:de:qucosa:82685 |
| Date | 25 January 2023 |
| Creators | Bektas, Erkan |
| Contributors | Wunderle, Bernhard, Hartmaier, Alexander, Technische Universität Chemnitz |
| Source Sets | Hochschulschriftenserver (HSSS) der SLUB Dresden |
| Language | English |
| Detected Language | English |
| Type | info:eu-repo/semantics/publishedVersion, doc-type:doctoralThesis, info:eu-repo/semantics/doctoralThesis, doc-type:Text |
| Rights | info:eu-repo/semantics/openAccess |
Page generated in 0.0022 seconds