Metallic materials play important roles in providing electrical, thermal, and mechanical functions in electronic devices and systems. The understanding of the electrical-thermal-mechanical interaction caused by the passage of electric current with high density is important to improve the performance and reliability of electronic assembly and packaging. The electromechanical interaction on the deformation behavior of copper and tin is studied in this work.
The electromechanical response of Cu strips was studied by passing a DC electric current. The electric resistance linearly increased with time before the occurrence of electric fusing. The electrothermal interaction led to the buckling of the Cu strips with the maximum deflection increasing with the increase of the electric current density. The total strain was found to be proportional to the square of the electric current density. A power law relation was used to describe the dependence of the time-to-fusing on the electric current density.
Using the nanoindentation technique, the effect of electric current on the indentation deformation of copper and tin was studied. The reduced contact modulus of copper and tin decreased with increasing the electric current density. With the passage of a DC electric current, the indentation hardness of copper increased slightly with increasing electric current density. With the passage of an AC electric current, the indentation hardness of copper decreased with increasing the indentation deformation. With the passage of a DC electric current, the indentation hardness of tin decreased with increasing the indentation load, showing the normal indentation size effect. Both the limit of infinite depth and the characteristic length were dependent on the electric current density.
Using the tensile creep technique, the creep deformation of pure tin was studied with the passage of a DC electric current. The steady state creep rate increased with the increase in temperature, tensile stress and electrical current density. For the same tensile stress and the same chamber temperature, the steady state creep rate increased linearly with the square of the electric current density. The electric current density has no significant effect on the stress exponent and activation energy of the tensile creep of tin for the experimental conditions.
| Identifer | oai:union.ndltd.org:uky.edu/oai:uknowledge.uky.edu:cme_etds-1019 |
| Date | 01 January 2013 |
| Creators | Zhao, Guangfeng |
| Publisher | UKnowledge |
| Source Sets | University of Kentucky |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | Theses and Dissertations--Chemical and Materials Engineering |
Page generated in 0.0015 seconds