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Solderability & microstructure of lead-free solder in leadframe packaging

Thesis (M.Sc.)--City University of Hong Kong, 2005. / At head of title: City University of Hong Kong, Department of Physics and Materials Science, Master of Science in materials engineering & nanotechnology dissertation. Title from title screen (viewed on Sept. 4, 2006) Includes bibliographical references.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/71776371
Date January 2005
CreatorsWoo, Belemy Hok Chung.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
Sourceaccess abstract and table of contents access full-text

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